HSINCHU, Taiwan, January 21, 2025 - United Microelectronics Corporation (“UMC”) today announced that the earthquake on January 21 at 00:17 registered as magnitude 5 at Fab 12A in Tainan, Taiwan. No injuries have been reported. There will be no significant impact on UMC's finances and business.
Teams are working hard to bring impacted equipment back online and resume operations. Some work-in-progress wafers were scrapped, but UMC expects limited impact to wafer shipments. UMC is working closely with customers who are affected to minimize any shipment delays caused by this incident. A full recovery is expected within 3-4 days.
UMC seeks to achieve the highest standard of semiconductor industrial safety through rigorous risk engineering controls and implementation of safety regulations and standards. The company’s regional diversified fab sites will help to ensure timely delivery of wafer shipments, which demonstrate UMC’s capability and resilience to provide world class manufacturing service.
Going forward, UMC will continue to seek ways to enhance fab safety and to improve the speed of recovery to minimize impact to customers, investors, and all stakeholders.
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