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Technology
2022-09-13

Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications
New standard solutions are the highest endurance, highest density and lowest power non-volatile memory options available
Technology
2022-08-24

UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies

Customers can leverage UMC and Cadence technologies to create designs for 5G, IoT, Displays, and Other Emerging Applications
Investor
2022-07-27

UMC 2Q 2022 Financial Results
CSR
2022-06-23

UMC’s climate goals validated by Science Based Targets initiative (SBTi)
Confirms pathway to achieve net zero emission by 2050
Investor
2022-05-27

UMC Shareholders Approve NT$3 Cash Dividend at Annual Shareholders’ Meeting
Corporate
2022-04-29

UMC Ranked Top 5% in Corporate Governance Evaluation for 8th Consecutive Year
Investor
2022-04-28

UMC Files Form 20-F for 2021 with US Securities and Exchange Commission
Investor
2022-04-27

UMC 1Q 2022 Financial Results
Corporate
2022-04-26

DENSO and USJC Collaborate on Automotive Power Semiconductors
An IGBT production line will be established at USJC, the Japan fab subsidiary of UMC
Investor
2022-02-24

UMC Board of Directors Announces Proposals for its Annual Shareholders Meeting
Corporate
2022-02-24

UMC announces new 22nm wafer fab in Singapore
Corporate
2022-02-24

UMC’s HeJian fab resumes production
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