This effect begins with the development of UMC's advanced technologies with a Yield Enhancement Vehicle (YEV) and the use of DFM solutions. Product support including tape out review help customers identify and address potential issues quickly. In addition, UMC fast yield feedback system and FA capability can accelerate product qualification and pilot run success. Together with an integrated wafer sort service, customers can attain production ramp for stable manufacturing with confidence.
Stage 1 : Design and Tape-out
UMC's quality practices include the implementation of Failure Mode and Analysis (FMEA) to ensure each customer's design success. This methodology identifies key milestones to target, including tape out success, timely wafer out, and fast production ramp-up. Key deliverables and gating items are assessed through criteria that range from Design Support Manual (DSM) readiness, device performance, and IP availability to reliability and package solutions. Resources are then committed and prepared to address each element so that a complete follow-through of the plan can be executed.