UMC is a 300mm manufacturing leader with several advanced 300mm fabs in operation. Fab 12A in Tainan, Taiwan has been in volume production for customer products since 2002 and is currently manufacturing products down to 14nm. The multi-phase complex is actually three separate fabs, consisting of Phases 1&2, 3&4, and 5&6. Fab 12A’s total production capacity is currently over 87,000 wafers month. UMC’s second 300mm fab, Fab 12i, is located in Singapore’s Pasir Ris Wafer Park. This second-generation 300mm facility is also in volume production, with capacity at 50,000 wafers per month.UMC’s newest 300mm fab, United Semi in Xiamen, China, began volume production in Q4, 2016. The total design capacity of United Semi is 50,000 wafers per month when fully equipped.
UMC’s geographically diversified 300mm manufacturing throughout Asia means customers can mitigate their manufacturing risk while still maintaining production within the same region to ensure seamless engineering support from UMC’s Taiwan headquarters.
Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves, which hand off the FOUPs to Rail Guided Vehicles (RGV) for intrabay moves. This system is typically around 3 to 4 times faster than the standard Automatic Guided Vehicle (AGV) intrabay system common in 200-mm fabs. Our newest 300mm fabs also feature equipment-to-equipment communication technology to further increase operating efficiency.
Ultimately, UMC’s leadership in 300mm production results in increased cost-efficiency and faster time to market for our customers. As die size increases with more and more advanced technology features being integrated into today’s system on chip (SOC) designs, these factors become increasingly important for companies to maintain their competitiveness.
UMC responds to the rigorous requirements for manufacturing efficiency, flexibility, and control with state-of-the-art 300mm fab automation systems featuring Front Opening Universal Pods (FOUPs), Automated Material Handling Systems (AMHs), and overhead Rail Guided Vehicle (RGV).
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Wavetek (WTK)
Wavetek (WTK)
Process : 3.5um - 0.45um
Design Capacity : 50,000 wafers/month
Wafer Size : 6"
Location : Hsin-Chu, Taiwan
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Fab 8AB
Fab 8AB
Process : 0.5um - 0.25um
Design Capacity : 70,000 wafers/month
Wafer Size : 8"
Location : Hsin-Chu, Taiwan
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Fab 8C
Fab 8C
Process : 0.35um - 0.11um
Design Capacity : 29,000 wafers/month
Wafer Size : 8"
Location : Hsin-Chu, Taiwan
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Fab 8D
Fab 8D
Process : 0.13um - 90nm
Design Capacity : 32,000 wafers/month
Wafer Size : 8"
Location : Hsin-Chu, Taiwan
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Fab 8E
Fab 8E
Process : 0.5um - 0.18um
Design Capacity : 35,000 wafers/month
Wafer Size : 8"
Location : Hsin-Chu, Taiwan
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Fab 8F
Fab 8F
Process : 0.18um - 0.11um
Design Capacity : 32,000 wafers/month
Wafer Size : 8"
Location : Hsinchu, Taiwan
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Fab 8S
Fab 8S
Process : 0.18um - 0.11um
Design Capacity : 25,000 wafers/month
Wafer Size : 8"
Location : Hsinchu, Taiwan
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HeJian (Fab 8N)
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HeJian (Fab 8N)
Process : 0.5um - 0.13um
Design Capacity : 50,000 wafers/month
Wafer Size : 8"
Location : Suzhou, China
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Fab 12A (12-inch Fab)
Fab 12A (12-inch Fab)
Process : 0.18um - 14nm
Design Capacity : 87,000 wafers/month
Wafer Size : 12"
Location : Tainan, Taiwan
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Fab 12i (12-inch Fab)
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Fab 12i (12-inch Fab)
Process : 0.13um - 40nm
Design Capacity : 45,000 wafers/month
Wafer Size : 12"
Location : Singapore
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United Semi Fab 12X (12-inch Fab)
USCXM Fab 12X (12-inch Fab)
Process : 40nm - 28nm
Design Capacity : 50,000 wafers/month
Wafer Size : 12"
Location : Xiamen, China
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USJC Fab 12M (12-inch Fab)
USJC Fab 12M (12-inch Fab)
Process : 90nm, 65nm and 40nmm
Design Capacity : 33,000 wafers/month
Wafer Size : 12"
Location : Kuwana, Mie, Japan
