We use cookies to improve your experience. By your continued use of this site you accept such use. To change your settings please see our Privacy Policy .
I Understand
UMC is a 300mm manufacturing leader with several advanced 300mm fabs in operation.

UMC is a 300mm manufacturing leader with several advanced 300mm fabs in operation. Fab 12A in Tainan, Taiwan has been in volume production for customer products since 2002 and is currently manufacturing products down to 14nm. The multi-phase complex is actually three separate fabs, consisting of Phases 1&2, 3&4, and 5&6. Fab 12A’s total production capacity is currently over 87,000 wafers month. UMC’s second 300mm fab, Fab 12i, is located in Singapore’s Pasir Ris Wafer Park. This second-generation 300mm facility is also in volume production, with capacity at 50,000 wafers per month.UMC’s newest 300mm fab, United Semi in Xiamen, China, began volume production in Q4, 2016. The total design capacity of United Semi is 50,000 wafers per month when fully equipped.


UMC’s geographically diversified 300mm manufacturing throughout Asia means customers can mitigate their manufacturing risk while still maintaining production within the same region to ensure seamless engineering support from UMC’s Taiwan headquarters.

umc_about_fab_info
Advanced Automation

Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves, which hand off the FOUPs to Rail Guided Vehicles (RGV) for intrabay moves. This system is typically around 3 to 4 times faster than the standard Automatic Guided Vehicle (AGV) intrabay system common in 200-mm fabs. Our newest 300mm fabs also feature equipment-to-equipment communication technology to further increase operating efficiency.

Ultimately, UMC’s leadership in 300mm production results in increased cost-efficiency and faster time to market for our customers. As die size increases with more and more advanced technology features being integrated into today’s system on chip (SOC) designs, these factors become increasingly important for companies to maintain their competitiveness.

UMC responds to the rigorous requirements for manufacturing efficiency, flexibility, and control with state-of-the-art 300mm fab automation systems featuring Front Opening Universal Pods (FOUPs), Automated Material Handling Systems (AMHs), and overhead Rail Guided Vehicle (RGV).

Expand All
  • Wavetek (WTK)

    Wavetek (WTK)

    Process : 3.5um - 0.45um

    Design Capacity : 50,000 wafers/month

    Wafer Size : 6"

    Location : Hsin-Chu, Taiwan

  • Fab 8AB

    Fab 8AB

    Process : 0.5um - 0.25um

    Design Capacity : 70,000 wafers/month

    Wafer Size : 8"

    Location : Hsin-Chu, Taiwan

  • Fab 8C

    Fab 8C

    Process : 0.35um - 0.11um

    Design Capacity : 29,000 wafers/month

    Wafer Size : 8"

    Location : Hsin-Chu, Taiwan

  • Fab 8D

    Fab 8D

    Process : 0.13um - 90nm

    Design Capacity : 32,000 wafers/month

    Wafer Size : 8"

    Location : Hsin-Chu, Taiwan

  • Fab 8E

    Fab 8E

    Process : 0.5um - 0.18um

    Design Capacity : 35,000 wafers/month

    Wafer Size : 8"

    Location : Hsin-Chu, Taiwan

  • Fab 8F

    Fab 8F

    Process : 0.18um - 0.11um

    Design Capacity : 32,000 wafers/month

    Wafer Size : 8"

    Location : Hsinchu, Taiwan

  • Fab 8S

    Fab 8S

    Process : 0.18um - 0.11um

    Design Capacity : 25,000 wafers/month

    Wafer Size : 8"

    Location : Hsinchu, Taiwan

  • HeJian (Fab 8N)

    HeJian (Fab 8N)

    Process : 0.5um - 0.13um

    Design Capacity : 50,000 wafers/month

    Wafer Size : 8"

    Location : Suzhou, China

  • Fab 12A (12-inch Fab)

    Fab 12A (12-inch Fab)

    Process : 0.18um - 14nm

    Design Capacity : 87,000 wafers/month

    Wafer Size : 12"

    Location : Tainan, Taiwan

  • Fab 12i (12-inch Fab)

    Fab 12i (12-inch Fab)

    Process : 0.13um - 40nm

    Design Capacity : 45,000 wafers/month

    Wafer Size : 12"

    Location : Singapore

  • United Semi Fab 12X (12-inch Fab)

    USCXM Fab 12X (12-inch Fab)

    Process : 40nm - 28nm

    Design Capacity : 50,000 wafers/month

    Wafer Size : 12"

    Location : Xiamen, China

  • USJC Fab 12M (12-inch Fab)

    USJC Fab 12M (12-inch Fab)

    Process : 90nm, 65nm and 40nmm

    Design Capacity : 33,000 wafers/month

    Wafer Size : 12"

    Location : Kuwana, Mie, Japan