Fab information

UMC is a 300mm manufacturing leader with several advanced 300mm fabs in operation. Fab 12A in Tainan, Taiwan has been in volume production for customer products since 2002 and is currently manufacturing products down to 14nm. The multi-phase complex is actually three separate fabs, consisting of Phases 1&2, 3&4, and 5&6. Fab 12A’s total production capacity is currently over 75,000 wafers month. UMC’s second 300mm fab, Fab 12i, is located in Singapore’s Pasir Ris Wafer Park. This second-generation 300mm facility is also in volume production, with capacity at 50,000 wafers per month.UMC’s newest 300mm fab, Uited Semi in Xiamen, China, began volume production in Q4, 2016. The total design capacity of Uited Semi is 50,000 wafers per month when fully equipped.

UMC’s geographically diversified 300mm manufacturing throughout Asia means customers can mitigate their manufacturing risk while still maintaining production within the same region to ensure seamless engineering support from UMC’s Taiwan headquarters.

300mm wafers have over twice the usable area as 200mm wafers, delivering productivity advantages of up 2.5 times the number of chips. This translates directly into greater competitive advantages for our customers. UMC’s 300mm facilities utilize state-of-the-art computer integrated manufacturing (CIM), which together with our extensive 300mm experience, has allowed UMC to achieve 300mm yields and cycle times comparable to our 200mm manufacturing.

Larger Die Sizes More Efficiently Utilize 300mm Wafer Area