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With mobile and wireless communications entering the 5G era, broadened bandwidth, low latency, improved connectivity features, and the ability to connect electronics on a massive scale will bring profound changes to our lives. With the continuous evolution and development of wireless connectivity technologies such as Wi-Fi, Bluetooth and LPWAN, this innovation will also enable semiconductor demand growth from various applications including smartphones, mobile computing, smart manufacturing, etc. As a leading worldwide semiconductor foundry, UMC provides comprehensive technologies across logic, RF, eHV, BCD and eNVM, allowing customers to select the optimal foundry process solutions and related devices for their mobile and wireless communication ICs, thus meeting the needs of future communication products. Furthermore, UMC provides process technologies that strengthen the devices energy-saving characteristics, enabling products to reduce carbon emissions in end-use applications in the value chain of relevant customers. |
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