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With mobile and wireless communications entering the 5G era, broadened bandwidth, low latency, improved connectivity features, and the ability to connect electronics on a massive scale will bring profound changes to our lives. With the continuous evolution and development of wireless connectivity technologies such as Wi-Fi, Bluetooth and LPWAN, this innovation will also enable semiconductor demand growth from various applications including smartphones, mobile computing, smart manufacturing, etc.

As a leading worldwide semiconductor foundry, UMC provides comprehensive technologies across logic, RF, eHV, BCD and eNVM to allow customers to have more options to choose the right foundry process solutions and related devices for their mobile and wireless communication ICs, thus meeting the needs of future communication products.

Logic/MM/RFCMOS

  • WW leading logic/MM and RFCMOS solution provider
  • Serving a wide range of applications, including embedded AP, digital/image/audio IC, RF transceiver, Wi-Fi, BT, mmWave etc.
  • Complete solution with Multiple Vt, cell library, RF model, IP options and low power features across different technology nodes
  • >5.7B units shipped annually

eHV

  • 1st among all foundries in global mobile DDIC shipments
  • End device applications cover smartphone, tablet and wearables
  • Technology leadership demonstrated from 180nm to 28nm
  • Leading foundry for 28nm AMOLED DDIC production

BCD/PMIC

  • >20% market share of PMIC foundry volume/revenue
  • >300M Mobile PMICs shipped in 2019
  • State-of-the-art 180nm & 110nm BCD solutions
  • >10 years of 12” BCD manufacturing

RFSOI

  • WW leading RFSOI provider with both capacitive and platform solutions offered
  • Suitable for RF front end component applications, such as RF switch, tuner, LNA in mobile or infrastructure device etc.
  • Solutions cover both 8-in and 12-in, from 0.18um to 55nm and beyond with excellent FOM
  • > 4.3B units shipped annually
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