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隨著行動和無線通訊進入5G時代,更寬的頻寬,更低的訊號傳輸延遲以及海量連接的能力,將為我們的生活帶來深遠的改變。 隨著Wi-Fi、藍牙和低功耗廣域網路(LPWAN)等無線連接技術不斷的演進與發展, 這些通訊技術的創新,將促使諸如智慧手機、行動計算、智慧製造等各種應用的半導體需求大幅增長。

身為晶圓專工的領導者,聯華電子提供全面且具競爭力的技術解決方案,包括邏輯、射頻、高壓製程、BCD製程和嵌入式非揮發性記憶體技術等,使客戶可以選擇適合的製程解決方案及元件為其行動和無線通訊晶片進行設計,以滿足未來通訊產品的需求。

Logic/MM/RFCMOS

  • WW leading logic/MM and RFCMOS solution provider
  • Serving a wide range of applications, including embedded AP, digital/image/audio IC, RF transceiver, Wi-Fi, BT, mmWave etc.
  • Complete solution with Multiple Vt, cell library, RF model, IP options and low power features across different technology nodes
  • >5.7B units shipped annually

eHV

  • 1st among all foundries in global mobile DDIC shipments
  • End device applications cover smartphone, tablet and wearables
  • Technology leadership demonstrated from 180nm to 28nm
  • Leading foundry for 28nm AMOLED DDIC production

BCD/PMIC

  • >20% market share of PMIC foundry volume/revenue
  • >300M Mobile PMICs shipped in 2019
  • State-of-the-art 180nm & 110nm BCD solutions
  • >10 years of 12” BCD manufacturing

RFSOI

  • WW leading RFSOI provider with both capacitive and platform solutions offered
  • Suitable for RF front end component applications, such as RF switch, tuner, LNA in mobile or infrastructure device etc.
  • Solutions cover both 8-in and 12-in, from 0.18um to 55nm and beyond with excellent FOM
  • > 4.3B units shipped annually
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