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我知道了

隨著互聯網連接已成為我們日常生活的一部分,物聯網相關產品已經快速地擴展到智慧終端裝置市場,而結合高性能及低功耗的半導體解決方案,為這些產品成功不可或缺的關鍵。物聯網已廣泛應用於智慧家居、智慧製造、智慧城市和遠距醫療等領域,而穿戴式裝置在半導體創新技術的協助下,已實現長時間隨時檢測和信息傳輸,奠定其在健康管理的角色。

聯電提供多樣化的製程技術解決方案,以推動物聯網和穿戴式裝置應用的發展,包括低功耗邏輯/混訊、嵌入式非揮發性記憶體,BCD製程和微機電技術,以協助客戶實現未來的產品設計。通過不間斷的技術開發和與客戶的緊密合作,聯電成為領先的物聯網晶圓專工廠和合作夥伴。

eNVM

  • Available to serve a broad range of applications from Smartcards, IoT/AIoT and Automotive
  • 12” solutions from 55nm to 28nm with multi-generations of MCUs with eFLASH
  • Our 40/55nm solutions have >40 customers and is in high volume production
  • MCU with eNVM is developing advanced MRAM and ReRAM solutions with our leading IP partners

Logic/MM/RFCMOS

  • Leading foundry to provide low power, low leakage features across different technology nodes
  • Best cost to performance balance options for a vast range of applications, with connectivity functions (e.g. NBIoT, LPWAN etc.)
  • Complete low power solutions with Multiple Vt, cell library, low power memory, RF model, IP options etc.
  • >855M units shipped annually

BCD/PMIC

  • >20% market share of PMIC foundry volume/revenue
  • BCD+eFlash solution in development to  drive higher efficiency for IoT and wearables
  • State-of-the-art 180nm & 110nm BCD
  • >10 years of 12” BCD manufacturing

MEMS

  • Leading, unique cost saving material process for MEMS microphone designs
  • Supports a wide range of applications from IoT (smart speakers and wearables) to Smart Mobile phones and industrial applications
  • UMC’s fundamental set of >12 building blocks help customers construct a wide variety of MEMS designs with high volume, cost effective manufacturing solutions
  • Volume production for MEMS microphone providers to tier 1 SMP and IoT customers
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