物聯網 & 穿戴式裝置

隨著互聯網連接已成為我們日常生活的一部分，物聯網相關產品已經快速地擴展到智慧終端裝置市場，而結合高性能及低功耗的半導體解決方案，為這些產品成功不可或缺的關鍵。物聯網已廣泛應用於智慧家居、智慧製造、智慧城市和遠距醫療等領域，而穿戴式裝置在半導體創新技術的協助下，已實現長時間隨時檢測和信息傳輸，奠定其在健康管理的角色。

聯電提供多樣化的製程技術解決方案，以推動物聯網和穿戴式裝置應用的發展，包括低功耗邏輯/混合信號、嵌入式非揮發性記憶體，BCD製程和微機電技術，以協助客戶實現未來的產品設計。通過不間斷的技術開發和與客戶的緊密合作，聯電成為領先的物聯網晶圓專工廠和合作夥伴。

eNVM

Available to serve a broad range of applications from Smartcards, IoT/AIoT and Automotive
12” solutions from 55nm to 28nm with multi-generations of MCUs with eFLASH
Our 40/55nm solutions have >40 customers and is in high volume production
MCU with eNVM is developing advanced MRAM and ReRAM solutions with our leading IP partners

Logic/MM/RFCMOS

Leading foundry to provide low power, low leakage features across different technology nodes
Best cost to performance balance options for a vast range of applications, with connectivity functions (e.g. NBIoT, LPWAN etc.)
Complete low power solutions with Multiple Vt, cell library, low power memory, RF model, IP options etc.
>855M units shipped annually

BCD/PMIC

>20% market share of PMIC foundry volume/revenue
BCD+eFlash solution in development to drive higher efficiency for IoT and wearables
State-of-the-art 180nm & 110nm BCD
>10 years of 12” BCD manufacturing

MEMS

Leading, unique cost saving material process for MEMS microphone designs
Supports a wide range of applications from IoT (smart speakers and wearables) to Smart Mobile phones and industrial applications
UMC’s fundamental set of >12 building blocks help customers construct a wide variety of MEMS designs with high volume, cost effective manufacturing solutions
Volume production for MEMS microphone providers to tier 1 SMP and IoT customers

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