市場應用 - 聯華電子

隨著互聯網連接已成為日常生活的一部分，物聯網相關產品已經快速地擴展到智慧終端裝置市場，而結合高性能及低功耗的半導體解決方案是這些產品不可或缺的關鍵。物聯網已廣泛應用於智慧家居、智慧製造、智慧城市和遠距醫療等領域，而穿戴式裝置在半導體創新技術的協助下，已實現可長時間隨時檢測和訊息傳輸，強化在健康管理功能的角色。

聯電提供多樣的製程技術解決方案，以推動物聯網和穿戴式裝置應用的發展，包括低功耗邏輯/混合訊號、嵌入式非揮發性記憶體，雙極-互補金屬氧化半導體-雙重擴散金屬氧化半導體製程和微機電技術，以協助客戶實現未來的產品設計。通過持續的技術開發和與客戶的緊密合作，聯電成為領先的物聯網積體電路製造的合作夥伴。

除了多種標準的 eNVM 製程技術之外，聯電還成功開發出電阻式記憶體 (RRAM) 與磁阻式記憶體 (MRAM) 製程技術，也都可以嵌入於邏輯製程中，以極低的待機電流運作，降低產品在終端應用的功耗，有助於聯電與客戶的整體價值鏈降低碳排放。

eNVM

Available to serve a broad range of applications from Smartcards, IoT/AIoT and Automotive
12” solutions from 55nm to 28nm with multi-generations of MCUs with eFLASH
Our 40/55nm solutions have >40 customers and is in high volume production
MCU with eNVM is developing advanced MRAM and ReRAM solutions with our leading IP partners

Logic/MM/RFCMOS

Leading foundry to provide low power, low leakage features across different technology nodes
Best cost to performance balance options for a vast range of applications, with connectivity functions (e.g. NBIoT, LPWAN etc.)
Complete low power solutions with Multiple Vt, cell library, low power memory, RF model, IP options etc.
>855M units shipped annually

BCD/PMIC

>20% market share of PMIC foundry volume/revenue
BCD+eFlash solution in development to drive higher efficiency for IoT and wearables
State-of-the-art 180nm & 110nm BCD
>10 years of 12” BCD manufacturing

MEMS

Leading, unique cost saving material process for MEMS microphone designs
Supports a wide range of applications from IoT (smart speakers and wearables) to Smart Mobile phones and industrial applications
UMC’s fundamental set of >12 building blocks help customers construct a wide variety of MEMS designs with high volume, cost effective manufacturing solutions
Volume production for MEMS microphone providers to tier 1 SMP and IoT customers

行動 & 無線通訊

計算 & 數據處理

車用電子

物聯網 & 穿戴式裝置