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網際網路的高速發展,促使了全球數據資料量的快速成長。面對海量的數據處理,將需要卓越的軟硬體結合的運算及擴充能力,而這都需要高性能、更低功耗的半導體技術的強力支援。

儘管摩爾定律在高性能計算的需求下不斷地推進其極限,然而成熟及特殊製程在此領域仍將扮演重要的角色。 聯華電子使用6-12英吋的晶圓生產14奈米以上下的半導體晶片,利用在PCIe、eDP和USBx等進階介面,同時滿足系統電源、電腦周邊設備和存儲裝置的需求。聯電為全球顯示器驅動晶片製造的領導者,且為多家全球領先的影像感測器公司提供先進影像訊號處理器晶片。

聯華電子使用6、8、12英吋晶圓,運用14奈米及以上的製程技術生產半導體晶片,除了使用在PCIe、eDP和USBx等進階介面應用,同時也滿足系統電源、電腦周邊設備和存儲裝置的需求。

eHV

  • Longest history in DDIC manufacturing among foundries
  • Applications covering NB, MNT, Tablet , TV, etc.
  • 0.8um to 110nm eHV solutions for large display driver ICs
  • >800M LDDI shipment in 2019

BCD/PMIC

  • >20% market share of PMIC foundry volume/revenue
  • >500M PMICs shipped for computing applications in 2019
  • State-of-the-art 110nm BCD for more digital implementation
  • >10 years of 12” BCD manufacturing

eNVM

  • Focusing on SIM and smart card solutions, UMC is a leading provider to financial and government ID agencies
  • UMC MCU with eNVM covers a broad range of applications, providing secure performance from Smartcards to IoT/AIoT
  • 12” solutions from 55nm to 40nm with multi-generations of MCUs with eNVM
  • Our 40/55nm solutions have >10 customers and is in high volume production.

Logic/MM/RFCMOS

  • Leading foundry to provide best bulk silicon technologies
  • Complete coverage of computing and data processing applications, including I/O, peripherals, accessories, storage controller etc.
  • Solution include multiple Vt, cell library and IP options across different technology nodes
  • >3.2B units shipped annually

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