Design
Service
Mask
Tooling
Wafer
Process
Wafer
Bumping
WLCSP
Wafer
Sorting
Yield
Management
Mgmt
Drop
Shipment
UMC provides customized backend turnkey service including Bump, Wafer Sorting, WLCSP and yield management.
To increase efficiency and leverage the core competencies of our partners, UMC delivers backend services through partnerships with OSAT closely. This flexible business model provides customers with multiple options to meet the backend requirements.
As a backend turnkey service to customers, UMC run a proactive yield management system to continuously improve product yield. This value-added competitive advantage is above and beyond what is performed at a traditional testing house.
While customer selects UMC as the foundry partner, multiple backend service options are available to meet various customers’ requirements. We operate on an open architecture service model that provides various flexible turnkey solutions. UMC could provide specific customized working flows with customer preferred OSATs, or only run inhouse CP sorting. We implemented comprehensive quality assurance system for OSAT management to ensure customer products backend quality.
We are well experienced in providing short turnaround time for backend operation with timely yield feedback to enable high quality yield enhancement.
Reduce Operating Resources & Efforts for OSAT Management
Earn Competitive Cost, Performance & Continuous Yield Improvement