UMC's testing services incorporate the latest software and hardware solutions to provide efficient, streamlined testing. We have equipped in-house CP facilities that are near every UMC fab to provide comprehensive
testing services. Customers can monitor test yield and WIP stages via the MyUMC online customer web portal.
Furthermore, UMC also offers verified package solutions, with an emphasis on solution development. With a robust low-K probing solution and advanced backend structures such as BOAC, UMC's development methodology is critical to ensure compatibility between silicon and package material.
Test Program Development & Services
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Testing Solution Development
Excellent and Diverse Experience in Program Development
Professional Hardware Design and Probe Card Making
Work with Customers for Cost Effective Test Solution Development
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Volume Production
Quick Silicon Validation for Fast Yield Feedback
Proactive Customized Test / Alert Report for Yield Monitor
Production Yield Monitoring and Improvement by Bin Limit Control Mechanism
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Customized Service
Remote Access Tester to Expedite Validation
Testing Sequence, Probing & Cleaning Recipe Optimization
Product Characterization by Corner Wafers
