Artificial Intelligence

The growth in generative AI is driving demand for ultra-high data speeds in data centers and high-performance computing applications. UMC’s interposer and advanced packaging technologies enable high-density integration of different chip types to achieve greater bandwidth and power efficiency. UMC is also developing silicon photonics technology for next-gen data center architectures.

• Logic/MS
• 2.5D/3D IC

As AI rapidly migrates from cloud to the AI, chip designers face the challenge of balancing processing power with size and power constraints. UMC’s advanced packaging technologies enable 3D integration for higher performance and bandwidth within compact designs. UMC’s BCD technology also enhances power efficiency in devices, critical for edge AI applications.

• Logic/MS
• 2.5D/3D IC
• BCD
• RFSOI

Widely deployed for public safety, disaster response, and traffic management, drones and surveillance systems require real-time data processing and low power consumption. UMC combines RF CMOS, advanced packaging and BCD technologies to provide high-performance, low-power chips to meet these needs, enhancing system transmission performance.

• Logic/MS
• RFCMOS
• BCD
• RFSOI
• 2.5D/3D IC

Semiconductors are fundamental to the advancement of robotics. UMC’s technologies enable the brains, microcontroller, sensing ability, and power management for modern robots, driving innovation in automation across industries and everyday life.

• Logic/MS
• BCD
• eNVM
• 2.5D/3D IC