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SUNNYVALE, Calif., - January 7, 2002 -Fast-Chip, Incorporated, a fabless semiconductor company dedicated to high-performance communications ICs, and one of the world's leading semiconductor foundries, UMC (NYSE: UMC), announced today that production has begun on PolicyEdge™, the industry's first OC-192 services processor.
Manufactured using UMC's 0.18 micron process technology, PolicyEdge delivers intelligent, high-performance classification, editing and statistics collection from 1 to 10 Gigabits per second. UMC's robust manufacturing process has produced better than expected yields from early wafers, allowing Fast-Chip to support two PolicyEdge speed grades for the emerging Metro services, IP router and multi-service switch markets.
Fu Tai Liou, senior vice president of worldwide marketing and sales at UMC said, "We are proud that our technology has helped enable Fast-Chip to achieve such a significant milestone in the development of merchant network processing products. Fast-Chip's advanced OC-192 design coupled with UMC's process technology allows PolicyEdge to achieve an impressive 10 Gbps line rate, demonstrating our industry leadership for a wide range of technology applications."
Featuring an industry-leading 700 Million Packet Operations per second in the base 100 MHz part, PolicyEdge sits in the data path between a framer and traffic manager. It can sustain 28 classification, editing and statistic operations on minimum size packets, while maintaining wire speed. PolicyEdge comes in PL3 for OC-48 or SPI-4 interface for OC-192 applications, supporting industry-standard glueless interfaces to other data path network devices. PolicyEdge is a single chip, cascadable device (no external memories required) that provides the industry's best cost, density and power metrics.
"Metro equipment vendors are showing incredible interest in PolicyEdge's capabilities, including mapping Transparent LAN services over MPLS - destined to be our largest opportunity moving forward," said Gregg Cook, president and CEO of Fast-Chip. "Partnering with UMC on their production grade 0.18 micron technology has accelerated the delivery of the industry's first OC-192 processing ASSP to our customers. This partnership will also provide us with the enhanced scalability and performance in 2002 when we produce our next generation chip using .13 micron geometries."
Fast-Chip utilized UMC's comprehensive fab services and support to develop PolicyEdge. In addition, Fast-Chip tapped UMC's Silicon Shuttle® Program to produce small lots of its services processor. This way, Fast-Chip was able to evaluate the PolicyEdge and ensure it met the requirements of its end users prior to committing to volume production.
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