Hsinchu, Taiwan (October 21, 2021) – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”) today recognized 18 partners for their excellent contributions at its 2021 Outstanding Supplier Awards.
UMC also took the opportunity today to reiterate its commitment to build a low carbon supply chain, aiming for a 20% reduction in carbon emissions and an increase of renewal energy usage to 20% of total power consumption by 2030. The company announced in June its target to achieve net zero carbon emissions by 2050, making it the first semiconductor foundry to do so.
SC Chien, UMC co-president and Chief Sustainability Officer (CSO), said: “The COVID-19 pandemic posed unprecedented challenges across all sectors around the world. We’re deeply grateful for our trusted partners and their support of our products and services, technological developments, and facility construction, enabling UMC to maintain stable production and on-time delivery to our customers. UMC has actively promoted green supply chain practices since 2017 through the ‘Triple R League’ initiative, which attracted the participation of 39 suppliers. This year, we started the next phase of the initiative, ‘Green Supply Chain 2.0'. We're thrilled that more than 500 companies have expressed interest to participate. Together, we're confident we will continue making great strides as we move towards our net zero goal.”
Louis Hsieh, UMC’s associate vice president of operations support, said: “The annual Supplier Awards is an important occasion for us to express our appreciation for our partners. This year, we selected 18 winners from over 1,000 companies, whose excellent services contribute significantly to our business. In June, UMC gained admissions into the RE100 global initiative and became the first foundry to commit to net zero carbon. To maximize impact, I would like to call on all our suppliers to work with us to reduce our supply chain’s carbon emissions and to strive towards a sustainable future.”
UMC promoted the Reduce, Reuse, and Recycle principle through the Triple R League initiative, which ran from 2017-2020 and brought together 39 suppliers. Total carbon reduction from this initiative over three years was the equivalent of 409,000 tons. Looking ahead, UMC will continue to work with upstream and downstream partners to provide better products and services while striving towards a sustainable supply chain.
- Excellent Collaboration and Partnership Award
Applied Materials, Inc.
ASML Holding N.V.
GlobalWafers Co., Ltd.
Lam Research Corporation
Merck Performance Materials Ltd.
Photronics DNP Mask Corp.,
Tokyo Electron Ltd.
- Excellent Strategic Partnership Award
Nikon Precision Ltd.
PERIC Special Gases Co.,Ltd
Leader Mutual Freight System Inc.
- Excellent Support and Partnership Award
Sanwa Engineering Corp.,
ADVANCED MICRO-FABRICATION EQUIPMENT
NAURA Technology Group Co., Ltd
PioTech Co., Ltd
SHENG LUAN ENTERPRISES CO., LTD.,
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with worldwide total 19,500 employees. For more information, please visit: https://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.