UMC’s 22nm process has up to a 10% area gain compared with the 28nm HKMG process and better power/performance ratio with enhanced RF performance. Iddq can be reduced by up to 30% @ fixed speed or its speed enhanced by up to 10% @ fixed iddq in certain conditions. Optional devices are added to offer a more flexible analog design environment for system-on-chip (SoC) designs.
The 22nm superset technology includes both ULP and ULL options on the same platform. This technology can support voltages from 1.0V to 0.6V. Customers can enjoy the advantages of both technologies within one platform for SoC designs.