As part of its sustainability strategy, UMC aims to increase investment in technologies that deliver enhanced energy efficiency, reducing carbon emissions along the value chain as well as the carbon footprints of end-products. UMC's technologies also contribute to global climate change mitigation by providing semiconductors to power electric vehicles, smart energy management systems, industrial automation, and optimization technology and systems. To align its technology development roadmap with carbon reduction goals, the company has set incremental goals through 2030 to expand the proportion of overall revenue derived from sustainable products.
Green Technology Development |
UMC offers ultra-low power (ULP) and ultra-low leakage (ULL) logic technology platforms, which can be integrated with the company's leading specialty processes to enhance energy saving characteristics of end-products.
Logic Process Technology |
For its 28nm logic process, UMC provides two types of high-performance and ultra-low-power options to suit different customer needs, including automotive applications. The 22nm logic process platform provides lower core operating voltage, demonstrating ultra-low leakage and energy-saving features. The 14nm process is more suitable for computing and data processing due to its high performance, low power consumption and low latency.
Embedded Non-Volatile Memory Technology (eNVM) |
UMC offers state-of-the-art eNVM solutions to meet a variety of embedded system applications. In addition to the standard eNVM solutions, UMC has also successfully developed resistive memory (RRAM) and magnetoresistive memory (MRAM) technologies, which can be embedded in logic processes and operate with very low standby electrical current, reducing the power consumption of products in end applications. Coupled with robust logic processes for peripheral devices, UMC produces energy efficient microcontrollers for a range of applications including automotive, smart factory, and consumer products.
Embedded High Voltage Technology (eHV) |
UMC has the industry's broadest portfolio of eHV process technologies and corresponding intellectual property solutions for display panel driver chips of all sizes. UMC's ultra-low leakage solution enables customers to integrate control logic, gate drivers, source drivers, and memories on the same IC to form a system-on-chip (SoC), which can achieve multiplexing and improve product performance without increasing power consumption.
Bipolar-CMOS-DMOS Technology (BCD) |
UMC's BCD platforms, backed by comprehensive eNVM options, deliver complete power management functions in a single chip. Customers' power management ICs produced using BCD technology exhibit lower energy loss during voltage conversion and boast a smaller form factor, making it a preferred solution for developing end-products that is more energy efficient.
Radio-Frequency Silicon-on-Insulator Technology (RFSOI) |
UMC's RFSOI technology, with its unique substrate characteristics capable of preventing low and high frequency doubled harmonics and reducing power loss, exhibits outstanding energy efficiency in end applications.
Clean Tech End Applications |
14nm Logic |
22nm Logic |
28nm Logic |
eNVM | eHV | BCD | RFSOI | |
Demand-Side Mgmt Home energy management systems, DDI/LCD controller, HVAC, Intrusion/fire detection system, Security gate, etc. |
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Industrial Automation Manufacturing systems, General-purpose automation modules, Environmental sensor, Compute electronics, Enterprise equipment, etc. |
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Optimization Tech & Syst Server with CPU sockets, Smart meter, Solid-State-Light, Storage system, Internet service provider, etc. |
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Hybrid/Electric Vehicles Driver information, Battery management, Power bank, Engine control, Powertrain, Remote keyless entry, Power steering, ADAS, etc. |
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Green Product Manufacture |
In addition to the dedication to providing core products with market competitiveness to meet our customers' demands, as a citizen of the Earth, UMC has also taken on the responsibility of developing green products with efforts to cherish resources and protect the environment starting from the source. In addition to reducing resource consumption and unnecessary pollution during the production process, we have taken our efforts a step further to acquire green factory certificates to strive to be a good green role model.
Green Process Management |
- In addition to complying with all applicable laws, regulations and standards, we have applied even higher standards for ourselves with the priority of replacing hazardous substances.
- We will promote green purchasing with proper management of hazardous substances within the production process starting from the source.
- Independent Green Chemical Product Research and Development
- Our process designs are heading towards slim and compact sizes to reduce material consumption, yet they also feature high performance and low power consumption.
- We will promote reduction of greenhouse gas emission, saving of energy and resources, and reduction of waste generated during the production process.
- We will promote the recycling and reuse of raw materials and product packaging materials.
Product Liability |
In June 2006, UMC completed Hazardous Substance Process Management (HSPM) and has received IECQ QC080000 qualification, which made UMC the first semiconductor manufacturer in the world to achieve QC080000 HSPM for all fabs. To ensure the products provided to customers meet international standards and customer requirements like EU RoHS, EU REACH, Montreal Protocol on Substances that Deplete the Ozone Layer et al., we tried our best to reduce environmental impact and to reach customer request. |
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Regarding product safety, UMC poses no direct potential threats to its customers or the general public since UMC does not have its own end products. However, to ensure that products provided to customers meet international standards and customer requirements, UMC established a cross-divisional HSPM committee to improve the efficacy of green product management. We have completed third-party QC080000 IECQ certification for management of hazardous substances to ensure that UMC provides products that conform with RoHS directives and customers' requirements.
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