2000
January
Completes consolidation of five companies: UMC, USC, UTEK, USIC and UICC
March
Ships first foundry chips using copper process
May
Produces foundry industry's first 0.13-micron integrated circuits
September
Makes its debut on the New York Stock Exchange
2003
January
Announces equipment move-in at UMCi
March
Delivers foundry's first customer ICs built on 90-nanometer
2004
March
UMCi moves to full-scale 12 inch production
May
90-nanometer full qualification and volume production
July
Completes acquisition of SiS Microelectronics Corp. fab (now known as Fab 8S)
December
Fully acquires its subsidiary UMCi; renamed UMC Fab 12i
2005
June
Delivers the foundry industry's first 65-nanometer customer products
August
Achieves record milestone of over 100,000 90-nanometer wafer shipments
2006
June
Becomes first IC company to achieve QC 080000 IECQ HSPM qualification for all fabs
November
Produces working 45-nanometer ICs
2007
January
Expands advanced technology complex in Tainan Science Park.
2008
September
Named as a global index component for Dow Jones Sustainability Indexes
October
UMC announces foundry industry's first 28nm SRAMs
2009
April
Delivers 40-nanometer customer ICs
December
Fully acquires Japan subsidiary UMCJ