市場應用 - 聯華電子

隨著行動和無線通訊進入 5G 時代，更大的頻寬、更低的訊號傳輸延遲及巨量連接的能力，將為我們的生活帶來深遠的改變。隨著 Wi-Fi、藍牙和低功耗廣域網路 (LPWAN) 等無線連接技術不斷的演進與發展，這些通訊技術的創新，將促使智慧手機、行動計算、智慧製造等各種應用的半導體需求大幅增長。

身為半導體積體電路製造的領導者，聯電提供全面且具競爭力的技術解決方案，包括邏輯、射頻、高壓製程、BCD 製程和嵌入式非揮發性記憶體技術等，提供客戶選擇適合的製程解決方案及元件為其行動和無線通訊晶片進行設計，以滿足未來通訊產品的需求。再者，聯電提供的製程技術，可強化元件的節能特性，使產品在客戶價值鏈的終端應用上降低碳排放。

Logic/MM/RFCMOS

WW leading logic/MM and RFCMOS solution provider
Serving a wide range of applications, including embedded AP, digital/image/audio IC, RF transceiver, Wi-Fi, BT, mmWave etc.
Complete solution with Multiple Vt, cell library, RF model, IP options and low power features across different technology nodes
>5.7B units shipped annually

eHV

1st among all foundries in global mobile DDIC shipments
End device applications cover smartphone, tablet and wearables
Technology leadership demonstrated from 180nm to 28nm
Leading foundry for 28nm AMOLED DDIC production

BCD/PMIC

>20% market share of PMIC foundry volume/revenue
>300M Mobile PMICs shipped in 2019
State-of-the-art 180nm & 110nm BCD solutions
>10 years of 12” BCD manufacturing

RFSOI

WW leading RFSOI provider with both capacitive and platform solutions offered
Suitable for RF front end component applications, such as RF switch, tuner, LNA in mobile or infrastructure device etc.
Solutions cover both 8-in and 12-in, from 0.18um to 55nm and beyond with excellent FOM
> 4.3B units shipped annually

物聯網 & 穿戴式裝置

計算 & 數據處理

車用電子

行動 & 無線通訊